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Synthesis of Phosphorus- and Fluorine-Containing Hyperbranched Imide Oligomers for Flame-Retardant Epoxy Thermosets.
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Effect of Nanoscale in Situ Interface Welding on the Macroscale Thermal Conductivity of Insulating Epoxy Composites: A Multiscale Simulation Investigation.
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Xing Liu, Zhenhong Xiao, Xianyong Liu, Yuling Liu, Jianqing Zhao, Shumei Liu.
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Design and synthesis of epoxy prepolymer containing aromatic imide structures for thermoset with excellent thermal, mechanical and dielectric properties.
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Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives.
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Preparation of Hydrophobic Low-k Epoxy Resins with High Adhesion Using a Benzocyclobutene-Rosin Modifier.
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Design and synthesis of anhydride-terminated imide oligomer containing phosphorus and fluorine for high-performance flame-retarded epoxy resins.
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Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives.
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Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives.
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Bin Wu, Gang Qian, Yuye Yan, Md Mofasserul Alam, Ru Xia, Jiasheng Qian.
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Design of Interconnected Carbon Fiber Thermal Management Composites with Effective EMI Shielding Activity.
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Green preparation of robust hydrophobic bio-based epoxy resin with low dielectric constant.
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Scalable Fabrication of High-Performance Bulk Nacre-Mimetic Materials on a Nanogrooved Surface.
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Functionalized mesoporous silica liquid crystal epoxy resin composite: an ideal low-dielectric hydrophobic material.
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Hongchuan Dong, Yunfan Liu, Yanming Cao, Juzhen Wu, Sida Zhang, Xinlong Zhang, Li Cheng.
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Terahertz-Based Method for Accurate Characterization of Early Water Absorption Properties of Epoxy Resins and Rapid Detection of Water Absorption.
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A flexible thermoelectric film based on Bi2Te3 for wearable applications.
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Le Li, Shuo Tan, Yunpeng Liu, Haoyi Li, Kezhi Xu, Guancheng Zhen, Xiaoxuan Yin, Tianfang Zhao, Wenhua Wu, Lei Yang.
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Resveratrol-Derived Liquid Crystal Epoxy Resin with Low-Dielectric Properties and Excellent Mechanical Strength and Toughness.
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