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Fabrication of Si3N4 ceramics with improved thermal conductivity by carbothermal reduction and two-step sintering

JOURNAL OF THE AMERICAN CERAMIC SOCIETY [2024]
Binbin Fan, Zunlan Hu, Shuo Zhao, Dengke Zhao, Bohan Wang, Shijia Zhang, Zhanglin Chen, Songmo Du, Fei Li, Jie Zhang, Feng Hu, Zhipeng Xie, Kexin Chen, Guanghua Liu
ABSTRACT

Si3N4 ceramics with improved thermal conductivity and mechanical properties were prepared by carbothermal reduction and two-step sintering. The addition of 2 wt% C led to the development of an intergranular phase YNSiO2 with reduced oxygen content. Notably, setting the pre-sintering temperature at 1450°C promoted the formation of a rough bimodal morphology within the Si3N4 ceramics. Furthermore, an extended holding period at 1850°C resulted in additional grain growth and the elimination of intergranular phases. The Si3N4 specimens produced at 1450°C for 3 h followed by 1850°C for 8 h, incorporating 2 wt% C, exhibited a notable continuity between Si3N4 grains. The thickness of the grain boundary layer was only about 1 nm, and the N/O atomic ratio of the intergranular phase was measured to be 0.42. Consequently, the resulting thermal conductivity, flexural strength, and fracture toughness of Si3N4 specimens were found to be 101 W·m −1 ·K −1 , 712 ± 29 MPa, and 7.7 ± 0.2 MPa·m 1/2 , respectively. Compared with samples without C additive and directly sintered at 1850°C for 8 h, the Si3N4 specimens produced in this work showed a significant increase of more than 50% in thermal conductivity and about 17% in fracture toughness.

MATERIALS

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