Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging

Background The demand for high-power density packaging and integration processes for third-generation semiconductors, like silicon carbide (SiC), necessitates advancements beyond conventional Si-based packaging technologies. Cu-Cu direct bonding emerges as a promising alternative in semiconductor packaging. However, achieving Cu-to-Cu direct bonding with low-temperature, low-pressure, and short-time poses significant challenges. Transient Liquid Phase Bonding (TLP) offers a low-temperature joining solution, but prolonged reflow time hinders its wide applications. Methods This study introduces a novel strategy utilizing bicontinuous microemulsion (BME) electrodeposition to fabricate micron-sized Cu arrays, addressing these challenges in achieving Cu bonding. The core of Cu array manufacturing lies in the differential electrodeposition rate of Cu ions in the aqueous and organic phases. This principle is rooted in the excellent conductivity of the aqueous solution compared to the non-conductivity of the organic solution. Significant findings We elucidate the growth mechanism and validate a theory for achieving void-free optimal growth of Cu arrays within BME and compared the cross-sectional morphology and fracture modes of TLP solder joints with micron and nano Cu arrays. Furthermore, the ability to recycle the BME soft template aligns with green chemistry principles, offering a sustainable die-attach approach for third-generation semiconductor device packaging.