A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper

At present, the mechanical properties of para aramid paper (PPTA paper) are still severely challenged since interface bonding defects. In this work, a novel method for improving the interface bonding of PPTA paper was proposed by introducing m-phenylenediamine (MPD) into PPTA molecular chain by copolymerization. Result showed that the addition of MPD could monitor the rigidity and glass transition temperature (Tg) of PPTA. The Tg generated by the copolymerized modified PPTA precipitated fibers (MAPFs) realized micro-melting bonding with adjacent fibers during hot-pressing process. Further optimization of MAPFs precipitation and hot-pressing process improved the tensile strength of paper. Results indicated that the tensile strength of paper made of MAPFs with 60% MPD far beyond PPTA paper (PAP), and was 1.07 times of Nomex paper. The method provides a reference value for the application of high performance PAP in lightweight and high strength fields, broadening the application field of PAP as well.