A composite system based on organic-inorganic interface modification: High temperature resistance, high modulus, and low coefficient of thermal expansion

With the rapid development of 5G communication technology, it is difficult to balance the comprehensive performance of packaging substrate materials in integrated circuits. In this study, a high-temperature resistant, high-modulus phthalazinone-bearing tetrafunctional epoxy resin (TEPZ) was used to modify an industrial multi-resin (benzoxazine/bismaleimide/biphenyl epoxy resin) system to prepare a composite system. On the basis of this system, the addition of KH560 modified SiO 2 gives the system the advantage of a low coefficient of thermal expansion. The prepared compound system has excellent comprehensive properties. The TGA and DMA tests showed that the system had excellent thermal properties, with the best performing experimental group reaching 5 % heat loss temperatures of 421 °C and 462 °C in nitrogen and air test atmospheres, respectively, and the T g of the composites reaching 309 °C; mechanical tests showed that the composites had a flexural modulus of 33 GPa; the TMA test results showed that the composites' z-axis compression CTE was as low as 17 ppm/°C. We believe that this new composite system can provide new ideas for the design concept of new generation of electronic packaging substrate materials.