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Core–shell structured dendritic CuO@TiO2 for high-k P(VDF-HFP) composites with suppressed dielectric loss and enhanced thermal conductivity

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS [2018]
Hu Liang, Xia Yuting, Wang Qianqian, Yang Hui, Zhang Qi-long
[10.1007/s10854-017-8032-x]
MATERIALS

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