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Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole

ELECTROCHIMICA ACTA [2018]
Li Zheng, Wei He, Kai Zhu, Chong Wang, Shouxu Wang, Yan Hong, Yuanming Chen, Guoyun Zhou, Hua Miao, Jinqun Zhou
[10.1016/j.electacta.2018.06.132]
MATERIALS

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