JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 2020; 31(11): 8923-8932.
Simultaneous improvement of the electrical conductivity and mechanical properties via double-bond introduction in the electrically conductive adhesives
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS [2020]
Su Yu, Zhang Lei, Liao Bing, Mai Yu L., Dai Yong Q., Hu Wei