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Improvement in chemical mechanical polishing of 4H-SiC wafer by activating persulfate through the synergistic effect of UV and TiO2

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY [2021]
Wantang Wang, Baoguo Zhang, Yunhui Shi, Tengda Ma, Jiakai Zhou, Ru Wang, Hanxiao Wang, Nengyuan Zeng
[10.1016/j.jmatprotec.2021.117150]
MATERIALS

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