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Investigation on Material Removal Mechanisms in Photocatalysis-Assisted Chemical Mechanical Polishing of 4H–SiC Wafers

International Journal of Precision Engineering and Manufacturing [2021]
He Yan, Yuan Zewei, Song Shuyuan, Gao Xingjun, Deng Wenjuan
[10.1007/s12541-021-00494-1]
MATERIALS

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