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Highly Thermally Conductive Graphene-Based Thermal Interface Materials with a Bilayer Structure for Central Processing Unit Cooling

ACS Applied Materials & Interfaces [2021]
Zhi-Guo Wang, Jia-Cheng Lv, Zi-Li Zheng, Ji-Guang Du, Kun Dai, Jun Lei, Ling Xu, Jia-Zhuang Xu, Zhong-Ming Li
PMID: 34009940 [10.1021/acsami.1c01223]
MATERIALS

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