High-temperature dielectric paper with high thermal conductivity and mechanical strength by engineering the aramid nanofibers and boron nitride nanotubes

Aramid paper is ubiquitous in advanced electronics and high-voltage equipment by virtue of their outstanding dielectric properties, mechanical reliability, and thermal stability. However, their limited thermal conductivity still fails to satisfy the stringent demands for heat dissipation in applications with high power and high energy density. Herein, we report a highly thermally conductive composite paper prepared by synergistically combining one-dimensional (1D) aramid nanofibers (ANFs), 1D edge-hydroxylated boron nitride nanotubes (BNNTs), and polyethyleneimine (PEI). The resultant composite paper exhibits high thermal conductivity (9.91 Wm −1 K −1 ), low dielectric loss (<0.01), and ultrahigh electrical breakdown strength (∼334 kV/mm) with an exceptional heat resistance performance. Three-dimensional hydrogen bonding networks were constructed between the ANF framework, PEI, and BNNTs, endowing the composite paper with a superior tensile strength (up to 317 MPa) and Young’s modulus (∼7.7 GPa), which are significantly higher than those of the commercial Nomex T410 paper. This research provides important insights into the design and fabrication of multifunctional insulating paper for application in modern integrated electronic and power systems.