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In Situ Constructing High-Performance, Recyclable Thermally Conductive Adhesives with a Hyperbranched-Star Reversibly Cross-Linking Structure

ACS Applied Polymer Materials [2023]
Jie He, Jinwei Song, Yuanjie Xu, Xuanhe Zhang, Hongtao Zhou, Wenbin Zhang, Yufei Li, Weili Yan, Huijian Ye, Lixin Xu
ABSTRACT

Thermally conductive adhesives have attracted considerable attention in recent years due to their dual functions in promoting interfacial bonding and thermal transfer. A great number of strategies have been explored for producing them. However, most of them are based on irreversible covalent cross-linking resins, which are difficult to be recycled. Herein, we demonstrate a strategy for in situ producing high-performance, recyclable thermal adhesives from common stocks with a reversibly cross-linkable hyperbranched-star copolymer, HBPE@PSF. The copolymer possesses a hyperbranched polyethylene core covalently bearing multiple polystyrene side chains with small amount of furan moieties, which can be synthesized from commercially available ethylene and styrene as the main monomers. As a stabilizer, the copolymer can effectively promote the exfoliation of hexagonal boron nitride (h-BN) in chloroform under sonication to render high-quality boron nanosheets (BNNSs). Moreover, some of the copolymer can be irreversibly adsorbed on the BNNS surface based on the noncovalent CH−π and π–π interactions. From the resultant nanofiller, BNNS/HBPE@PSF composite adhesives have been successfully prepared through an in situ solution cast process directly with the copolymer as the matrix. After the cross-linking via the Diels–Alder reaction, the resultant adhesives simultaneously exhibit excellent interfacial bonding, thermal transfer, and recyclability, despite their extremely low furan content, 0.30 mol %. This has been confirmed to originate from the unique chain structure of the copolymer, which can form a hyperbranched-star, reversibly cross-linking structure in the composite system. The composite adhesives obtained herein may find their important applications as thermal interface materials in the areas of various electronic products.

MATERIALS

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