Facile constructing Ti3C2Tx/TiO2@C heterostructures for excellent microwave absorption properties

Optimizing and enhancing the performance of electromagnetic wave (EMW) absorption materials relies on the modification of their composition and structure through heterogeneous interface engineering. Ti 3 C 2 T x ’s high conductivity results in an impedance mismatch, which hinders efficient EMW absorption. Herein, a one–step catalytic chemical vapor deposition (CCVD) method is used to construct the Ti 3 C 2 T x /TiO 2 @C heterogeneous structure. Upon annealing at 500 °C, amorphous carbon is uniformly deposited on the Ti 3 C 2 T x surface, thereby incorporating the scale–like TiO 2 generated during the process. The inclusion of the amorphous carbon layer and TiO 2 reduces the substrate’s conductivity, achieving optimized impedance matching. Additionally, building heterogeneous interfaces between Ti 3 C 2 T x , TiO 2 , and C enriches multiple loss mechanisms involving dipole and interfacial polarization, ultimately enabling optimal EMW absorption performance. The minimum reflection loss ( RL min ) value of Ti 3 C 2 T x /TiO 2 @C–500 is –53.12 dB when its thickness and frequency are 1.15 mm and 13.80 GHz, respectively. Moreover, thermal infrared imaging confirms that coatings fabricated using Ti 3 C 2 T x /TiO 2 @C–500 demonstrate a favorable heat dissipation rate, validating its effectiveness in addressing the challenge of efficient heat dissipation in electronic devices. This study significantly contributes to the progress of two–dimensional (2D) materials, enabling high–performance EMW absorption and expanding their applications in complex scenarios.