H-ZIF-Based Shape Memory Phase Change Materials for Thermal Management, Energy Conversion, and Electromagnetic Shielding

The rapid progress in technology has led to widespread adoption of electronic devices. However, this increased usage has brought about concerns regarding both environmental impact and human health. As a result, there is a growing demand for the development of intelligent devices that can address both electromagnetic interference (EMI) shielding and effective thermal management simultaneously. In this work, we introduce a simple approach for the fabrication of flexible conductive phase change materials (FCPCMs). By combining hollow ZIF-67 (H-ZIF) nanoparticles with a high encapsulation efficiency alongside conductive carbon cloth, we found that the hollow nanoparticles provide excellent encapsulation capabilities. Unlike traditional PCMs, this FCPCM exhibits a unique ability to efficiently convert, store, and release heat energy when stimulated by both light and electricity. Furthermore, the distinctive composite structure of this material enables shape memory, allowing for an EMI shielding switch that responds to changes in temperature. This study not only contributes to the advancement of multifunctional flexible PCMs but also explores the convergence of thermal management and electromagnetic shielding, paving the way for further research and applications in this field.