Interface optimization of graphene paper–Cu composite prepared by electrodeposition

A room-temperature electrodeposition method with an organic electrolyte was developed to fabricate a HNO 3 -pretreated graphene paper Cu (GP′–Cu) composite. To improve the interfacial bonding of GP′–Cu composite, magnetron sputtering technology was used to create a “sandwich” structural gradient GP′–Cu composite. The selection of the intermediate transition layer metal was based on two-dimensional disregistry. Scanning electron microscopy, X-ray photoelectron spectroscopy, and other analytical methods confirmed that the addition of an intermediate transition metal (Cr, Ni) layer reduced the gap distance and enhanced the interfacial bonding of the GP′ and Cu deposited layers. The GP′–Ni–Cu composite exhibited the largest increase in tensile strength and conductivity. In addition, it had the highest thermal diffusivity and elongation at break among the GP′–Cu, GP′–Cr–Cu and GP′–Ni–Cu composites.