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Hexyltriethoxysilane - >97.0%(GC), high purity , CAS No.18166-37-5

    Grade & Purity:
  • ≥97%(GC)
In stock
Item Number
H157218
Grouped product items
SKU Size
Availability
Price Qty
H157218-25ml
25ml
3
$22.90
H157218-100ml
100ml
3
$82.90
H157218-500ml
500ml
Available within 4-8 weeks(?)
Items will be manufactured post-order and can take 4-8 weeks. Thank you for your patience!
$133.90

Basic Description

Synonyms triethoxy(hexyl)silane | n-Hexyltriethoxysilane | Triethoxyhexylsilane
Specifications & Purity ≥97%(GC)
Storage Temp Argon charged
Shipped In Normal

Taxonomic Classification

Taxonomy Tree

Kingdom Organic compounds
Superclass Organometallic compounds
Class Organometalloid compounds
Subclass Organosilicon compounds
Intermediate Tree Nodes Alkoxysilanes
Direct Parent Trialkoxysilanes
Alternative Parents Silyl ethers  Organoheterosilanes  Organic metalloid salts  Organooxygen compounds  Hydrocarbon derivatives  
Molecular Framework Aliphatic acyclic compounds
Substituents Trialkoxysilane - Silyl ether - Organoheterosilane - Organic metalloid salt - Organic oxygen compound - Hydrocarbon derivative - Organooxygen compound - Aliphatic acyclic compound
Description This compound belongs to the class of organic compounds known as trialkoxysilanes. These are organosilicon compounds with the general formula RO[Si](R')(OR'')OR''' (R-R''' = aliphatic organyl group).
External Descriptors Not available

Names and Identifiers

Pubchem Sid 504763025
Pubchem Sid Url https://pubchem.ncbi.nlm.nih.gov/substance/504763025
IUPAC Name triethoxy(hexyl)silane
INCHI InChI=1S/C12H28O3Si/c1-5-9-10-11-12-16(13-6-2,14-7-3)15-8-4/h5-12H2,1-4H3
InChIKey WUMSTCDLAYQDNO-UHFFFAOYSA-N
Smiles CCCCCC[Si](OCC)(OCC)OCC
Isomeric SMILES CCCCCC[Si](OCC)(OCC)OCC
Molecular Weight 248.44
Reaxy-Rn 1757895
Reaxys-RN_link_address https://www.reaxys.com/reaxys/secured/hopinto.do?context=S&query=IDE.XRN=1757895&ln=

Certificates(CoA,COO,BSE/TSE and Analysis Chart)

C of A & Other Certificates(BSE/TSE, COO):
Analytical Chart:

Find and download the COA for your product by matching the lot number on the packaging.

11 results found

Lot Number Certificate Type Date Item
I2212034 Certificate of Analysis Jun 17, 2024 H157218
I2212035 Certificate of Analysis Jun 17, 2024 H157218
E2423510 Certificate of Analysis May 06, 2024 H157218
E2423514 Certificate of Analysis May 06, 2024 H157218
E2423511 Certificate of Analysis May 06, 2024 H157218
K2113613 Certificate of Analysis Aug 18, 2023 H157218
K2113651 Certificate of Analysis Aug 18, 2023 H157218
K2113627 Certificate of Analysis Aug 18, 2023 H157218
C2126057 Certificate of Analysis Jan 12, 2023 H157218
C2126058 Certificate of Analysis Jan 12, 2023 H157218
I2212036 Certificate of Analysis Jul 21, 2022 H157218

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Chemical and Physical Properties

Sensitivity Moisture sensitive.
Refractive Index 1.41
Flash Point(°C) 95 °C
Boil Point(°C) 115 °C/18 mmHg
Molecular Weight 248.430 g/mol
XLogP3
Hydrogen Bond Donor Count 0
Hydrogen Bond Acceptor Count 3
Rotatable Bond Count 11
Exact Mass 248.181 Da
Monoisotopic Mass 248.181 Da
Topological Polar Surface Area 27.700 Ų
Heavy Atom Count 16
Formal Charge 0
Complexity 136.000
Isotope Atom Count 0
Defined Atom Stereocenter Count 0
Undefined Atom Stereocenter Count 0
Defined Bond Stereocenter Count 0
Undefined Bond Stereocenter Count 0
The total count of all stereochemical bonds 0
Covalently-Bonded Unit Count 1

Citations of This Product

1. Xiaohui Meng, Dong Qiu.  (2023)  Surface morphology regulation of colloidal Nanoparticles: A convenient Kinetically-Controlled seeded growth strategy.  JOURNAL OF COLLOID AND INTERFACE SCIENCE,  633  (284). 
2. Zaifu Jin, JinHong Li, Jiaqing Zhao, Yixuan Ge.  (2024)  Effect of Surface Functionalization of Si3N4 Fillers on Thermal and Mechanical Properties of TIMs.  Advanced Materials Interfaces,    (2400503). 
3. Shuaiwei Peng, Tianguan Wang, Guang Huang, Zhuofu Tang, Ziya Shao, Zhiyuan Feng, Bing Lei, Guozhe Meng, Honglei Guo.  (2024)  Unraveling the complex infiltration and repairing behaviors in defect coatings.  JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,  187  (258). 

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